High quality Electronic Board Assembly is offered by China manufacturer Hoshineo Lcd-Tech. Buy Electronic Board Assembly which is of high quality directly.
Our Electronic Board Assembly comes with a range of features that make it stand out from other products in the market. Some of the key features include:
1. High-quality components: Our board is made with top-quality components that ensure reliability and durability.
2. Advanced technology: Our board is designed using advanced technology to provide the optimal performance for electronic devices.
3. Easy to use: Our board is easy to install and use, reducing the time and effort required for setup.
4. Compact design: Our board is small and compact, making it easy to integrate into your electronic device.
5. Customizable: Our board can be customized to meet the specific needs of your electronic device.
Electroless Nickel Immersion Gold PCB provided by Hoshineo Lcd-Tech is widely used in many fields. ENIG process is a surface treatment process of electroless nickel plating on PCB bare copper and then gold leaching. The treated PCB board has good contact conductivity and assembly and welding performance.
item |
value |
Place of Origin |
zhejiang, China |
Base Material |
FR-4/ High TGFR-4/Arlon |
Copper Thickness |
1-5 oz |
Board Thickness |
1.0MM |
Min. Hole Size |
0.2MM |
Min. Line Width |
0.1mm/3MIL |
Min. Line Spacing |
0.1mm/3MIL |
Surface Finishing |
ENIG |
Board Size |
OEM PCB |
Application |
Electronics Device |
Type |
Mainboard PCB Assembly |
Style |
Consume Electronic PCBA |
Interface |
LVDS, EDP, RS232, UART, USB, PCIE, Audio, RJ45, HD, Mr. Speaker. |
Size |
14X10X2cm |
Weight |
1kg |
Certificate |
ISO ROHS for PCB PCBA assembly |
Protect copper surface:
ENIG process through the formation of a layer of nickel phosphorus alloy layer and gold layer on the copper surface, effectively prevent copper oxidation and corrosion, protect the PCB copper line and pad.
High welding reliability:
The gold layer has good welding performance, so that the components can be solidly welded on the PCB, improving the reliability and stability of the welding points.
Meet the requirements of small-pitch components:
With the continuous miniaturization and integration of electronic products, the requirements for PCB surface smoothness are getting higher and higher. The ENIG process provides a high flatness surface to meet the welding needs of small-pitch components.
Extend PCB life:
The dual protection of nickel and gold layers enables Electroless Nickel Immersion Gold PCB to have a longer service life. Stable performance and reliability, even in harsh environments.
Packing & Delivery
Utilize vacuum packaging made from thickened plastic to ensure exceptional sealing strength and resilience against breakage. For enhanced external protection, the packaging employs a sturdy 3K-K laminated carton, which is further bolstered with foam padding for additional safeguard measures.